AI's next bottleneck: Why even the best chips made in the U.S. take a round trip to Taiwan
Nvidia has reserved the majority of TSMC’s most advanced packaging capacity. The lesser-known chipmaking step may become the next bottleneck for AI.
Last updated: 2026-04-08 19:19:33 ET
Nvidia has reserved the majority of TSMC’s most advanced packaging capacity. The lesser-known chipmaking step may become the next bottleneck for AI.
Nvidia-backed Asia AI data center provider Firmus has now raised $1.35 billion in six months.
Anthropic on Tuesday announced Project Glasswing, a sweeping cybersecurity initiative that pairs an unreleased frontier AI model — Claude Mythos Pre...
OpenAI says it has raised $122 billion in a new funding round, valuing the company at approximately $852 billion, as competition to build large-scale ...
Jensen Huang walked onto the GTC stage Monday wearing his trademark leather jacket and carrying, as it turned out, the blueprints for a new kind of in...
The baton of open source AI models has been passed on between several companies over the years since ChatGPT debuted in late 2022, from Meta with its ...
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