Intel Hires Former SK Hynix CEO Seok-Hee Lee To Lead Advanced Packaging Push As Apple Partnership Fuels Foundry Revival
Intel Corp. (NASDAQ:INTC) has appointed former SK Hynix and SK On chief executive Seok-Hee Lee as executive vice president of its contract chip-manufacturing business. Intel Strengthens Advanced Packaging Strategy In a statement, Intel said Lee will report directly to CEO Lip-Bu Tan and oversee advanced packaging, system integration, back-end technology development and back-end manufacturing. “Lee will lead all adva…
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